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| MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Features * 802.11b/g and Bluetooth Applications * Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band * High Isolation: 32 dB Typical on RX * Low Harmonics: <-70 dBc @ 20 dBm * Flip-chip configuration * RoHS* Compliant Rev. V1 Die Bump Pad Layout (bump side up) Description MA-COM's MASW-009276-000DIE is a bumped GaAs PHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. The MASW-009276-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications. Die Bump Pad Configuration Name VC1 BT GND RX Description Voltage Control 1 Blue Tooth TX/RX Port Ground 2.5 GHz RX Port Voltage Control 3 2.5 GHz TX Port Voltage Control 2 Antenna Port Ordering Information Part Number MASW-009276-000D3K MASW-009276-001SMB Package Die in 3000 piece reel Sample Board SP3T VC3 TX VC2 RFC Absolute Maximum Ratings 1,2 Parameter Input Power @ 3 V Control Input Power @ 5 V Control Operating Voltage Operating Temperature Storage Temperature Absolute Maximum +32 dBm +35 dBm +8 volts -40C to +85C -65C to +150C 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM does not recommend sustained operation near these survivability limits. 1 * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Electrical Specifications3: TA = 25C, Z0 = 50 , Vc = 0 V / 3 V, Pin = 0 dBm Parameter Insertion Loss Isolation Return Loss IP3 Input P1dB Harmonics Control Current 3. External blocking capacitors on all RF ports. Rev. V1 Test Conditions RFC to Tx/Rx/BT, 2.4 GHz RFC to Tx, 2.4 GHz RFC to Rx, 2.4 GHz RFC to BT, 2.4 GHz 2.4 - 2.5 GHz RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing RFC to Tx, 2.4 GHz RFC to Rx, 2.4 GHz RFC to BT, 2.4 GHz RFC to Tx 2.4 GHz, 20 dBm |Vc| = 3 V Units dB dB dB dB dB dBm dBm dBm A Min. -- 20 30 20 -- -- -- -- -- -- -- Typ. 0.5 24 32 24 15 55 32 28 32 -75 <1 Max. 0.75 -- -- -- -- -- -- -- -- -- 2 Recommended PCB Configuration Truth Table 4,5,6 VC1 VC2 VC3 RFC-BT RFC-TX RFC-RX 1 0 0 0 1 0 0 0 1 On Off Off Off On Off Off Off On 4. For positive voltage control, external DC blocking capacitors are required on all RF ports. 5. Differential voltage, V(state 1) - V(state 0), must be +2.7 V minimum and must not exceed +5 V. 6. 0 = 0 0.3 V, 1 = +2.7 V to +5 V. Handling Procedures Parts List Part C1 - C4 C5 - C7 Value 39 pF 1000 pF Case Style 0402 0402 Please observe the following precautions to avoid damage: Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Product Consistency Distribution Charts7 (on wafer RF test) LS L Rev. V1 Process Capability P rocess Data LS L 20 Target * S ample M ean 24.1799 O v erall C apability P pk 8.55 LS L Process Capability P rocess Data LS L 30 Target * S ample M ean 32.0545 O v erall C apability P pk 3.04 18 19 20 21 22 23 24 25 26 27 28 28 29 30 31 32 33 34 35 36 37 38 TX and andIsolation (dB) (dB) Tx BT BT Isolation RRX Isolation (dB) X Isolation (dB) LB Process Capability P rocess Data LB 0 Target * USL 0.75 S ample M ean 0.513984 O v erall C apability P pk 2.64 USL LB Process Capability P rocess Data LB 0 Target * USL 2 S ample M ean 0.272007 USL O v erall C apability P pk 3.69 -0.0 0.1 0.2 0.3 0.4 0.5 0.6 Insertion - All (dB) Insertion Loss Loss Paths (dB) 0.7 0.00 0.28 0.56 0.84 1.12 1.40 1.68 Switch Current --All Paths (A) Current All Paths (uA) 1.96 7. Represents >5 wafers, tested per electrical specifications, probed directly on the die to the solder bump: TA = 25C, Z0 = 50 , VC = 0/3V, PIN = 0 dBm 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Typical Performance Curves (plots = chip on board assembly) TX Insertion Loss 0.80 +25C -40C +85C Rev. V1 TX Isolation 35 0.75 30 +25C -40C +85C 0.70 25 0.65 20 0.60 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) RX Insertion Loss 0.75 RX Isolation 35 0.70 30 0.65 25 +25C -40C +85C 0.60 +25C -40C +85C 20 0.55 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) BT Insertion Loss 0.80 +25C -40C +85C BT Isolation 35 0.75 30 +25C -40C +85C 0.70 25 0.65 20 0.60 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Die Dimensions (Top and Side Views) PCB Top Metal / Solder Mask Rev. V1 Die Bump Pad Layout - Top View (bump side up) Die Bump Pad Layout - Bottom View (bump side down - as installed on board) 8. Orientation mark is only on material that is shipped in tape and reel. The mark is not available on die shipped on grip ring. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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